半导体加工中的资料迷信 SCIE

期刊简介估计审稿时候： 约1.7个月 约3.7周

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

《半导体加工中的资料迷信》为会商（光）电子、传感器、探测器、生物手艺和绿色能源的功效资料和器件的新型加工、利用和实际研讨供给了一个怪异的服装论坛t.vhao.net。

每期都旨在供给以后看法、新成绩、冲破和将来趋向的快照，触及微电子、能量转换和存储、通信、生物手艺、（光）催化、纳米和薄膜手艺、夹杂和复合资料、化学加工、气相堆积、器件制作和建模等差别范畴，这些范畴是进步前辈半导体加工和利用的支柱。

内容包含：亚微米器件的进步前辈光刻手艺；蚀刻及相干主题；离子注入；毁伤演化和相干题目；等离子体和热 CVD；疾速热处置；进步前辈的金属化和互连计划；薄介电层、氧化；溶胶-凝胶处置；化学浴和（电）化学堆积；复合半导体加工；新型非氧化物资料及其利用； (大)份子和夹杂资料；份子能源学、重新算体例、蒙特卡罗等；分立电路和集成电路的新资料和新工艺；磁性资料和自旋电子学；异质布局和量子器件；半导体电学和光学特征的工程；晶体发展机制；靠得住性、缺点密度、固有杂质和缺点。

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